Product description
Probe assembly for XE RTP chamber use; .080 diameter and sapphire probe wording are suggested.
Specifications and identifiers
identification
| Normalized item type | RTP chamber probe assembly |
|---|
key attributes
| Application | XE RTP chamber |
|---|
| Diameter note | .080 DI mentioned in several titles |
|---|
| Material note | Sapphire appears in one title |
|---|
Equipment context
- Applied Materials XE RTP chamber
Applications
process chamber hardwarewafer handling or alignment assembliestool mechanical subassembliesRTP chamber probing or sensing interfacehigh-temperature chamber hardware
How it works
A plate, shield, cover, or similar machined part is a mechanical component used to position, isolate, cover, or protect part of a process module.
Fit, material, surface condition, coating, and revision can be critical in vacuum and process environments.
Technical guide
- 300 mm
- Common wafer/tool size reference for 300 mm semiconductor equipment.
What to verify before purchase
- Confirm probe set quantity, diameter, material, revision, and exact chamber configuration.
Confirm with the seller
- Sapphire material is suggested by one title but not confirmed across all evidence.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.