Product description
Plate, perforated oxide, 200mm, TEOS showerhead/perforated plate.
Specifications and identifiers
identified features
| Wafer size context | 200mm Indicates use with 200mm process hardware. |
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| Process context | TEOS oxide TEOS is commonly associated with oxide CVD processes. |
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| Form | Perforated plate / showerhead Perforations distribute gas or process flow across the wafer area. |
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Applications
process chamber hardwarewafer handling hardwaremaintenance replacement partsTEOS oxide process chamber gas distribution200mm CVD chamber maintenance
How it works
A machined or fabricated component used in the process chamber, transfer area, or wafer-handling hardware.
Fit, coating, material, wafer size, and chamber position affect process compatibility and contamination control.
Technical guide
- ASSY
- Assembly
- CVD
- Chemical vapor deposition
- PVD
- Physical vapor deposition
What to verify before purchase
- Verify hole pattern, diameter, surface condition, and cleaning status.
- Confirm exact chamber/platform revision before installation.
Confirm with the seller
- Exact tool model and material grade are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.