Product description
Cover ring for 200 mm SIP/Kachina chamber use; descriptions reference arc-spray/Cleanpart preparation and Ta(N)/Ti process context.
Specifications and identifiers
identification
| Component type | Cover ring Ring-shaped chamber part used near the wafer/process area. |
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| Wafer size reference | 200 mm / 8 in Supported by multiple descriptions. |
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| Process/tool context | SIP, Ta(N), Ti, Kachina Context terms indicate sputter/PVD chamber usage; verify exact chamber configuration. |
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| Surface/process reference | Arc-spray / Cleanpart / TWAS Indicates surface preparation or coating/cleaning context. |
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Applications
PVD chamber consumablesWafer-edge/process-zone shieldingChamber refurbishmentPVD chamber shieldingWafer-edge process protectionContamination control around chamber hardware
How it works
A cover ring used as a replaceable semiconductor-equipment or industrial-tool component.
Correct identification matters because fit, connector style, calibration, cleanliness, and revision can determine whether the part will install and operate correctly.
Technical guide
titanium_tantalum_nitride_context
Ta(N)/Ti references are process-context terms, not confirmed bulk material of the ring.
arc_spray
Thermal spray surface process used to create textured or protective surfaces on chamber hardware.
- SIP
- Self-ionized plasma, commonly associated with PVD source/chamber designs.
- TWAS
- Thermal wire arc spray, a coating process acronym often used for chamber parts.
What to verify before purchase
- Actual material and coating
- Cleanliness/packaging
- Chamber family and revision
Confirm with the seller
- Exact tool configuration beyond supported references
- Current operational condition
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.