Product description
8 inch shadow cover ring associated with G3 TiN seed process hardware on Applied Materials equipment.
Specifications and identifiers
ring identification
| Ring type | Cover ring / shadow ring |
|---|
| Nominal size | 8 inch indicated in most evidence |
|---|
| Process wording | TiN seed / G3 TiN seed |
|---|
Applications
process chamber rebuildsESC and pedestal protectionplasma-facing hardwarePVD/CVD chamber maintenancePVD shadowing or shieldingTiN seed process hardwareprocess kit replacement
How it works
A chamber-facing ceramic, sapphire, or insulating process component.
Chamber parts can affect plasma exposure, particle control, thermal behavior, and fit around wafer or electrode hardware.
Technical guide
ceramic_or_sapphire
Ceramic and sapphire are used where electrical insulation, plasma resistance, optical transmission, or thermal stability are needed.
- ESC
- Electrostatic chuck, a wafer-holding component used in many plasma process tools.
What to verify before purchase
- Confirm 8 inch configuration, revision, and process kit compatibility.
- One source includes 13 inch/101-COH wording; verify against the physical part.
Confirm with the seller
- Exact platform and alternate 13 inch wording are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.