Product description
Shield, 8 in., 101 COH Ti lower, for Applied Materials chamber hardware
Specifications and identifiers
supported identity
| item noun | Shield Process/chamber shield component. |
|---|
| size | 8 in. Repeated size callout. |
|---|
| material/context | Ti lower / 101 COH Titanium lower shield wording appears; exact coating/process meaning should be verified. |
|---|
Applications
PVD/CVD chamber kitsplasma chamber shieldingwafer-edge or source-area protectionLower shield replacement in 8 in process chamberPVD/CVD process-area shielding
How it works
A chamber ring, shield, insert, or cover ring is a process-area component used around the wafer or chamber opening.
Geometry, coating, material, and wafer size affect process uniformity, particle control, and fit.
Technical guide
ceramic_or_metal
Exact material or coating should be verified; many chamber rings are ceramic, aluminum, titanium, or coated metal depending on process.
process kit
Replaceable chamber hardware exposed to process gases or plasma.
- CVD
- chemical vapor deposition
- ESC
- electrostatic chuck
- PVD
- physical vapor deposition
What to verify before purchase
- Verify material/coating and surface condition
- Confirm 101 COH terminology and chamber fit
- Check cleaning/reuse suitability
Confirm with the seller
- Exact coating
- Exact tool platform
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.