Product description
Clamp ring, 6 inch JMF 2.5 mm REECR G-12 TiN
Specifications and identifiers
identification
| Item type | Clamp ring Circular chamber/process-kit hardware. |
|---|
| Size/context | 6 in, 2.5 mm Dimensional context from provided evidence. |
|---|
| Material/coating callout | G-12 TiN Verify whether TiN refers to coating, material, or process designation. |
|---|
Applications
PVD/CVD process chamberswafer clamping or shielding locationsprocess kit replacementProcess chamber clamp ring replacementPVD/CVD process kit hardware
How it works
A circular chamber hardware part used around the wafer or process area to clamp, shield, focus, or control exposure of adjacent surfaces.
Rings in semiconductor tools are often process-critical consumables or precision chamber parts; small differences in material, coating, size, or revision can affect fit and process performance.
Technical guide
TiN
Titanium nitride coating or material reference when called out; verify exact coating and base material before use.
ceramic/quartz/metal
Common ring materials vary by chamber location and process chemistry.
process kit
Replaceable chamber hardware that interfaces with wafers, plasma, gases, or shields.
- JMF
- Platform or chamber-context abbreviation; exact expansion not confirmed.
- TIN
- Often titanium nitride; confirm whether the source means TiN coating/material.
What to verify before purchase
- Verify exact revision and dimensional drawing.
- Confirm material/coating and chamber/tool compatibility.
Confirm with the seller
- Exact JMF/REECR expansion and compatible chamber are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.