Product description
Ring, restraint, HTESC, 8 in, 9 mm, Ti/TiN
Specifications and identifiers
identified attributes
| Item type | Restraint ring Chamber ring/hardware component. |
|---|
| Configuration | 8 in, 9 mm Dimensional descriptors appear consistently. |
|---|
| Material/coating | Ti/TiN Title evidence supports titanium/titanium nitride wording; verify against OEM print. |
|---|
| Revision | Rev B Revision appears in multiple descriptions. |
|---|
Applications
CVD chambersetch chambersPVD chamberswafer support/shieldinggas distribution or process uniformityHTESC chamber hardware8 inch wafer chamber servicerestraint ring replacement
How it works
A chamber hardware component such as a ring, plate, shield, faceplate, or cover used in a wafer processing module.
Geometry, material, coating, wafer size, and process chamber variant are critical for fit and process performance.
Technical guide
ceramic_quartz_metal
Chamber parts may be ceramic, quartz, aluminum, graphite, stainless steel, or coated metal depending on the specific item; use only confirmed material fields for this part.
chamber_hardware
Physical process chamber hardware affects plasma exposure, gas flow, heat transfer, shielding, and wafer handling.
- ESC
- Electrostatic chuck
- SACVD
- Sub-atmospheric chemical vapor deposition
- TEOS
- Tetraethyl orthosilicate process chemistry context
- TiN
- Titanium nitride
What to verify before purchase
- Confirm 8 inch/9 mm geometry and Ti/TiN construction from part marking or drawing.
- Verify HTESC spelling/context and revision.
Confirm with the seller
- Exact base material, coating thickness, and chamber compatibility beyond HTESC context are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.