Product description
Pumping plate for common/conformal silane context, 13-hole / 200 mm descriptors.
Specifications and identifiers
details
| Wafer size | 200 mm |
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| Hole pattern | 13-hole wording appears |
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| Process descriptor | Common/conformal silane context |
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identification
| Normalized item type | Pumping plate |
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| Supported description | Pumping plate for common/conformal silane context, 13-hole / 200 mm descriptors. |
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Applications
PVD/CVD/etch process chamberselectrostatic chuck assembliesdeposition shields, liners, rings, and coversGas/exhaust conductance management in process chamberReplacement pumping plate in 200 mm chamber hardware
How it works
A chamber or wafer-processing hardware component used around the wafer, chamber wall, source area, or electrostatic chuck stack.
Geometry, material, coating, and wafer size strongly affect process fit, plasma exposure, and contamination control.
Technical guide
ceramic_or_metal
Many chamber parts use ceramics, aluminum, stainless steel, quartz, or coated metals depending on plasma and chemistry exposure.
ESC
Electrostatic chuck hardware clamps or supports wafers during processing.
What to verify before purchase
- Confirm 13-hole pattern and conformal/common silane variant.
- Verify surface finish and any coating/cleaning requirements.
Confirm with the seller
- Exact machine compatibility beyond the named platform/context is not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.