Product description
Gas distribution plate with .156 inch thickness; hole count should be verified before approval.
Specifications and identifiers
part attributes
| Function | Gas distribution plate Distributes process gas through a perforated plate. |
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| Thickness | .156 inch Dimensional attribute to verify. |
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| Hole-count variants | 145 holes or 245 holes Verify by inspection or drawing. |
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| Assembly area | Process chamber gas distribution Likely gas distribution/chamber hardware area. |
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Equipment context
- Applied Materials process chamber
Applications
process chamberspedestal and wafer support areasgas distribution and pumping pathsPVD/CVD chamber kitsgas distributionshowerhead or diffusion plate servicechamber hardware replacement
How it works
A chamber or process-module hardware component used around the wafer, pedestal, plasma, gas distribution, or chamber body area.
Geometry, material, coating, wafer size, and process family are critical because these parts affect plasma exposure, thermal behavior, contamination control, and mechanical fit.
Technical guide
Vespel
A high-performance polyimide used for selected high-temperature or low-outgassing hardware.
ceramic
Ceramic parts are common in plasma-facing or high-temperature regions because of electrical insulation and process resistance.
quartz
Quartz is used where optical transmission, thermal behavior, or chemical cleanliness is important.
sapphire
Sapphire windows or lenses are used where optical transmission and hardness are needed.
- ESC
- Electrostatic chuck, a wafer-holding assembly that uses electrostatic force.
What to verify before purchase
- Physically verify hole count before approval.
- Confirm material, coating, diameter, and revision.
- Check flatness and surface contamination.
Confirm with the seller
- Exact hole count is not confirmed due to conflicting product notes.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.