Product description
300mm titanium cover ring with CleanCoat for ESIP TA(N) context, Applied Materials part 0020-48305.
Specifications and identifiers
supported details
| Diameter class | 300 mm Wafer/process-size class in descriptions. |
|---|
| Material/coating | Ti with CleanCoat Indicates titanium cover ring with a proprietary or process coating. |
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| Process context | ESIP TA(N) Process/tool context term that should be verified for compatibility. |
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Applications
chamber hardwarewafer handlingvacuum hardwareprocess module maintenancePVD/sputter chamber cover ring replacement.Process kit maintenance where 300 mm ESIP TA(N) cover ring configuration matches.
How it works
A cover ring used as a fitted mechanical part in a semiconductor process tool or wafer-handling subsystem.
Mechanical chamber parts must match dimensions, mounting features, material/coating, and process exposure requirements.
Technical guide
CleanCoat
Coating term appears in descriptions; exact coating specification is not confirmed.
Titanium
Often used in chamber hardware where process compatibility and coating condition matter.
- ESIP
- Applied Materials process/platform term; exact expansion not confirmed
- TA(N)
- tantalum nitride or related process context when used in semiconductor sputter/metal applications
What to verify before purchase
- Verify coating condition and part revision.
- Confirm 300 mm process kit compatibility and whether the part is paired with 0021-40241 in the target BOM.
Confirm with the seller
- Exact tool compatibility beyond the supported platform or description is not confirmed.
- Condition, calibration state, and service history are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.