Product description
Faceplate, DXZ / APRDL TEOS, AMAT-5200 context
Specifications and identifiers
identified attributes
| Item type | Faceplate Chamber plate component. |
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| Process/module context | DXZ, APRDL TEOS, AMAT-5200 Context appears in supported descriptions; exact configuration should be verified. |
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| Surface/feature context | Anodized, 200 mm, wafers/alignment mentioned Some descriptors appear in the evidence but should be verified. |
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Equipment context
- Applied Materials AMAT-5200 / DXZ
Applications
CVD chambersetch chambersPVD chamberswafer support/shieldinggas distribution or process uniformityDXZ chamber faceplate replacementTEOS process chamber hardwareAMAT-5200/DXZ service
How it works
A chamber hardware component such as a ring, plate, shield, faceplate, or cover used in a wafer processing module.
Geometry, material, coating, wafer size, and process chamber variant are critical for fit and process performance.
Technical guide
ceramic_quartz_metal
Chamber parts may be ceramic, quartz, aluminum, graphite, stainless steel, or coated metal depending on the specific item; use only confirmed material fields for this part.
chamber_hardware
Physical process chamber hardware affects plasma exposure, gas flow, heat transfer, shielding, and wafer handling.
- ESC
- Electrostatic chuck
- SACVD
- Sub-atmospheric chemical vapor deposition
- TEOS
- Tetraethyl orthosilicate process chemistry context
- TiN
- Titanium nitride
What to verify before purchase
- Confirm whether required part is DXZ DCVD, APRDL TEOS, or alignment faceplate configuration.
- Verify dimensions, material, anodizing/coating, and cleanliness.
Confirm with the seller
- Exact material, coating, and chamber revision are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.