Product description
Applied Materials 0021-11368 300 mm PVD cover ring, described for LTESC/Cu small cover-ring service with related SIP/Cu wording.
Specifications and identifiers
identification
| Description | Cover ring |
|---|
| Nominal size | 300 mm |
|---|
| Process context | PVD, Cu/LTESC/SIP wording |
|---|
Applications
PVD/CVD chamber kitsESC/focus-ring stackswafer-area consumables300 mm PVD chamber cover-ring replacementCu process chamber hardwareWafer-area ring stack service
How it works
A shaped ring, plate, shield, or liner used around the wafer or chamber process area.
Geometry, material, coating, and cleanliness affect plasma behavior, sealing, contamination risk, and fit.
Technical guide
aluminum
common chamber hardware material
quartz
plasma-compatible ceramic glass used in high-temperature or plasma-exposed parts
stainless steel
metal used where durability and chemical resistance are needed
- 200 mm
- wafer-size class or nominal chamber component size
- 300 mm
- wafer-size class or nominal chamber component size
What to verify before purchase
- Verify exact material/coating and whether it is LTESC, SIP, or another chamber variant
- Confirm diameter, profile, and revision
- Inspect for erosion, deposits, and refurbish/cleaning status
Confirm with the seller
- One related title describes upper shield; exact variant should be verified
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.