Product description
300 mm BESC shutter disk, SNNF context, revision 004 appearing in some descriptions.
Specifications and identifiers
component details
| Component | Shutter disk Shutter disk wording is consistent. |
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| Wafer size context | 300 mm 300 mm appears repeatedly. |
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| Process/module context | BESC / SNNF Supported descriptors; exact expansion should be verified. |
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| Revision reference | Rev 004 appears in some records Revision may vary by unit. |
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Applications
Etch chambersPVD/CVD chambersLoad locksTransfer modulesProcess shutter disk replacementWafer/chamber shielding or shutter mechanism
How it works
A chamber component is a process-facing or vacuum-facing part used inside or around a semiconductor process module.
These parts can affect plasma confinement, deposition uniformity, wafer support, contamination control, and vacuum sealing.
Technical guide
common
Often process-compatible metals, ceramics, quartz, engineered polymers, or coated surfaces.
process compatibility
Material and coating compatibility are important because parts may see plasma, heat, vacuum, or process gases.
What to verify before purchase
- Verify revision, material, coating, and whether the disk is new, cleaned, or refurbished.
Confirm with the seller
- Exact chamber and material/coating are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.