Product description
Cover ring for 8 in SIP Ta/TaN SZBESC application context
Specifications and identifiers
identification
| Supported description | Cover ring, 8 in SIP Ta/TaN, SZBESC |
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| Wafer size context | 8 in Indicates 200 mm class wafer/chamber context. |
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| Process/platform wording | SIP Ta/TaN, SZBESC Specific application codes are present but not expanded from the evidence. |
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Applications
semiconductor process chamberswafer edge hardwareplasma or deposition chamber consumableswafer/chamber edge cover hardwareprocess-area ring replacement
How it works
A ring-shaped chamber component used around wafers or process hardware to define edges, clamp, shield, cover, or manage process exposure.
Correct ring geometry, material, and wafer size are important because these parts sit close to the process area and can affect fit, plasma exposure, particles, and uniformity.
Technical guide
- SIP
- SIP is likely a platform/process abbreviation in this context; exact expansion is not confirmed from the provided evidence.
- SZBESC
- Internal or platform-specific code not expanded from the provided evidence.
- Ta/TaN
- Tantalum/tantalum nitride wording indicates the part is associated with a tantalum/tantalum-nitride process context, but the coating/material of this ring is not independently confirmed.
What to verify before purchase
- Confirm exact chamber/platform and revision code.
- Verify dimensions, material/coating, and condition of process-facing surfaces.
Confirm with the seller
- Exact tool model compatibility
- Exact material or coating of the ring
- Meaning of SZBESC
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.