Product description
Cover ring, 300 mm SST, for Applied Materials chamber hardware; also referenced as ring cover / chamber kit component.
Specifications and identifiers
configuration
| Component type | Cover ring |
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| Referenced process context | Cu / CSP / Endura Context appears in the evidence but should be verified for exact chamber compatibility. |
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physical
| Wafer size context | 300 mm |
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| Material marking | SST Likely stainless steel; verify material marking or OEM documentation. |
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revision context
| Referenced revision | Rev 008 A revision is referenced; match required revision when replacing. |
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Equipment context
- Applied Materials Endura 300 mm platform
Applications
PVD chamber kitsCVD or etch chamber consumables300 mm wafer process hardwarePVD or chamber kit cover ring replacementWafer-area shielding or spacing component
How it works
A ring-shaped chamber component used around the wafer or process area to control shielding, spacing, containment, or deposition exposure.
Ring geometry, wafer size, material, coating, and process family can affect particle control, process uniformity, and fit in the chamber kit.
Technical guide
SST
Stainless steel, when specified, is used for corrosion resistance and mechanical durability.
TTN
Likely titanium nitride when used in PVD/chamber context; verify coating/material marking before use.
- 300 mm
- Wafer size context referenced by the provided evidence.
- PVD
- Physical vapor deposition.
What to verify before purchase
- Confirm 300 mm SST version and revision.
- Verify chamber family and process kit position before use.
Confirm with the seller
- Exact chamber location and compatibility are not fully confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.