Product description
Cover ring, TTN, 300 mm PVD, for Applied Materials chamber hardware.
Specifications and identifiers
condition handling
| Cleanliness references | Cleaned/bagged or new in some evidence Cleanliness statements should be verified for actual inventory condition. |
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configuration
| Component type | Cover ring |
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| Process context | PVD |
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physical
| Wafer size context | 300 mm |
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| Material/coating marking | TTN Likely titanium nitride in PVD context; verify material or coating directly. |
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Applications
PVD chamber kitsCVD or etch chamber consumables300 mm wafer process hardwarePVD chamber cover ringChamber kit consumable / process shielding component
How it works
A ring-shaped chamber component used around the wafer or process area to control shielding, spacing, containment, or deposition exposure.
Ring geometry, wafer size, material, coating, and process family can affect particle control, process uniformity, and fit in the chamber kit.
Technical guide
SST
Stainless steel, when specified, is used for corrosion resistance and mechanical durability.
TTN
Likely titanium nitride when used in PVD/chamber context; verify coating/material marking before use.
- 300 mm
- Wafer size context referenced by the provided evidence.
- PVD
- Physical vapor deposition.
What to verify before purchase
- Confirm TTN material/coating, wafer size, and process kit position.
- Verify revision and cleaning/packaging requirements.
Confirm with the seller
- Exact chamber model is not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.