Product description
8 in buffer blade for HP+/HTHU RCF-compatible Applied Materials wafer-handling hardware.
Specifications and identifiers
identified features
| Component | blade Primary identity. |
|---|
| Size | 8 in Repeated size clue. |
|---|
| Application clue | buffer HP+ / HTHU Repeated context terms. |
|---|
| Compatibility clue | RCF compatible Several descriptions include RCF compatibility. |
|---|
Equipment context
- Applied Materials HP+/HTHU wafer-handling hardware
Applications
process chamber hardwarewafer handling hardwarePVD, CVD, or etch process kitsWafer transfer or buffer handlingRobot/end-effector service
How it works
A mechanical chamber, handling, or process-kit component used inside or around semiconductor equipment.
Geometry, material, coating, and process position can affect plasma behavior, wafer handling, contamination control, and fit.
Technical guide
material_note
Verify material and coating from markings or OEM documentation before process use.
What to verify before purchase
- Blade material and surface condition
- Flatness and edge damage
- Exact HP+/HTHU/RCF compatibility
Confirm with the seller
- Robot arm model
- Wafer-contact qualification
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.