Product description
Applied Materials 0021-35749 TXZ isolator ring, 200 mm, SNNF context.
Specifications and identifiers
identification
| Description | Ring, isolator, TXZ |
|---|
| Nominal size | 200 mm |
|---|
| Process/context marker | SNNF |
|---|
Applications
PVD/CVD chamber kitsESC and cathode stacksprocess chamber liner and shield replacementTXZ chamber isolator ring replacement200 mm process hardwareESC/chamber ring stack service
How it works
A process-facing ring, liner, shield, or ceramic/quartz chamber component used around the wafer or chamber opening.
Geometry, material, surface condition, and cleanliness affect process uniformity, plasma behavior, particle risk, and fit.
Technical guide
alumina
ceramic material used where electrical insulation and plasma compatibility are needed
aluminum
common chamber hardware material when compatible with the process
quartz
high-purity silica glass used for plasma-facing or high-temperature parts
- ESC
- electrostatic chuck
- PVD
- physical vapor deposition
What to verify before purchase
- Verify material and surface finish
- Confirm 200 mm geometry and SNNF context
- Inspect for wear or process deposits
Confirm with the seller
- Exact tool/chamber compatibility is not confirmed
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.