Product description
Inner shield for TXZ CVD 300 mm Applied Materials chamber context.
Specifications and identifiers
physical
| Component type | Inner shield |
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| Tool/process context | TXZ CVD |
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| Wafer size context | 300 mm |
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revision context
| Revisions referenced | Rev 006 / Rev 008 appear in evidence Verify the revision needed for the target chamber. |
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Applications
PVD chamber kitsEtch chamber kitsCVD process hardwareESC-adjacent ringsCVD inner shield replacement300 mm TXZ chamber shield hardware
How it works
A ring, cover, focus ring, clamp ring, or shield sits around the wafer/process area to control plasma exposure, deposition, containment, or mechanical alignment.
Small differences in profile, wafer size, material, and revision can affect process uniformity and chamber compatibility.
Technical guide
Vespel
Polyimide material used for heat-resistant, low-wear parts.
ceramic
Hard, insulating, plasma-resistant material used in some chamber rings and shields.
poly
Polymer material context from the provided evidence; verify exact material grade.
- clamp_ring
- A ring used to hold, locate, or clamp process hardware or wafer-related components.
- focus_ring
- A ring near the wafer edge that helps shape plasma or process conditions.
What to verify before purchase
- Verify revision, dimensions, material/coating, cleaned condition, and chamber compatibility.
- Do not assume Endura compatibility without BOM confirmation even where referenced context appears.
Confirm with the seller
- Exact material/coating and cross-platform compatibility are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.