Product description
Cavity / applicator for remote plasma clean in HDP-CVD context.
Specifications and identifiers
supported identity
| Function | Remote plasma clean cavity Component used in the remote plasma clean path. |
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| Process context | HDP-CVD High-density plasma CVD context appears repeatedly. |
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| Alternate wording | RPSC applicator / chamber applicator Some descriptions use applicator wording for the same functional area. |
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Applications
process chambersPVD/CVD/etch hardwarewafer-edge controlgas distribution or chamber shieldingHDP-CVD remote plasma clean hardwarePlasma clean applicator/cavity service
How it works
A process-chamber mechanical or consumable component shaped for a specific wafer size, chamber location, or process module.
Geometry, material, coating, cleanliness, and wafer-size compatibility can directly affect plasma behavior, particle control, and fit.
Technical guide
possible
ceramic, quartz, silicon, aluminum, stainless steel, titanium, or coated metals may be used depending on the specific component; only listed materials should be treated as confirmed
- CVD
- chemical vapor deposition
- ESC
- electrostatic chuck
- HDP-CVD
- high-density plasma chemical vapor deposition
- PVD
- physical vapor deposition
What to verify before purchase
- Verify applicator/cavity revision, chamber generation, and surface condition.
Confirm with the seller
- Exact tool configuration and revision compatibility are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.