Product description
Applied Materials 0040-39990 200 mm dual-zone electrostatic chuck assembly, described as Super-E / EMXP+ in source wording.
Specifications and identifiers
esc identity
| Wafer size | 200 mm / 8 inch |
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| Zone type | Dual zone |
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| ESC family/context | Super-E / EMXP+ mentioned in evidence |
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Applications
plasma etch chambersPVD chamberswafer clamping and thermal controlwafer clampingplasma chamber thermal control200 mm etch or PVD chamber service
How it works
An electrostatic chuck holds a wafer using electrostatic force during processing.
Wafer size, zone design, dielectric condition, backside gas path, and revision are critical to clamping and thermal performance.
What to verify before purchase
- Verify ESC revision, surface condition, clamp/leak testing, backside gas paths, resistance/insulation values, and paired assembly numbers.
Confirm with the seller
- Exact chamber model, electrical specifications, and refurbishment quality are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.