0040-55456 / BELLJAR, 21 OD 300MM PC XT-XTE / APPLIED MATERIALS AMAT0040-55456 / BELLJAR, 21 OD 300MM PC XT/XTE / APPLIED MATERIALS AMATAMAT Applied Materials 0040-55456 300mm Quartz Bell JarAMAT Applied Materials 0040-55456 300mm Quartz Bell JarAMAT Applied Materials 0040-55456 300mm Quartz Bell JarAPPLIED MATERIALS 0040-55456 BELLJAR, 21 OD 300MM PC XT/XTE AMAT *UNUSED*AMAT Applied Materials 0040-55456 300mm Quartz Bell JarApplied Materials AMAT 0040-55456 Bell Jar, 21 OD 300mm PC XT/XTE0040-55456 / BELLJAR, 21 OD 300MM PC XT/XTE / APPLIED MATERIALS AMAT AMAT Applied Materials 0040-55456 300mm Quartz Bell Jar 633007491-F Copper UsedAPPLIED MATERIALS 0040-55456 BELLJAR 21 OD 300MM PC XT/XTE AMAT *UNUSED, SEALED*APPLIED MATERIALS 0040-55456 300MM QUARTZ BELLJAR PC XT/XTE AMAT *UNUSED*APPLIED MATERIALS 0040-55456 BELL JAR 300MM PC XT/XTEAPPLIED MATERIALS 0040-55456 300MM QUARTZ BELLJAR PC XT/XTE AMAT *UNUSED* NEW Applied Materials 0040-55456 Bell Jar, 300mm, PC XT/XTE w/ 60 day warranty
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APPLIED MATERIALS 0040-55456

300 mm Quartz Bell Jar

Market Availability & Pricing

Part number0040-55456
ManufacturerAPPLIED MATERIALS
Current availabilitySee listings below
Latest completed listing with reported sales5693.89 (currency not captured) — public listing price; reported sold quantity is not a verified transaction
Mechanical › Chamber Components › Quartz Bell Jars
300 mm Quartz Bell Jar
APPLIED MATERIALS0040-55456quartz bell jar
Product description
Bell jar, 21-inch OD, 300 mm PC XT/XTE; quartz material supported by evidence.
Specifications and identifiers
supported identity
FunctionBell jar
Repeated evidence identifies a bell jar.
MaterialQuartz
Several sources identify quartz.
Size/platform clue21 OD / 300 mm PC XT/XTE
Repeated evidence includes these descriptors.
Equipment context
  • Semiconductor process equipment
Applications
etch chambersCVD chambersPVD chamberswafer clampingprocess shieldingquartz chamber hardware300 mm PC XT/XTE process chamber servicebell-jar replacement
How it works

A wafer-contact or process-facing ring, shield, window, pedestal, clamp, or plate used near the wafer/process area.

Diameter, material, coating, cleanliness, notch orientation, and revision directly affect process fit and contamination risk.

Technical guide
evidence_scope

Only material terms supported by provided evidence should be treated as likely.

typical

quartz, ceramic, alumina, stainless steel, Vespel, aluminum, or process-specific coated metals

CVD

chemical vapor deposition

ESC

electrostatic chuck

PVD

physical vapor deposition

200mm
8-inch wafer-class tooling
300mm
12-inch wafer-class tooling
What to verify before purchase
  • Verify exact OD, mounting geometry, and cleaning/unused status.
  • Confirm whether copper-related wording in one source describes included hardware or another assembly.
Confirm with the seller
  • Full dimensional drawing.
  • Exact chamber version.

Product reference only. Confirm fitment, revision, included components, and specifications before purchase.

Documentation

No public documents were listed for this part when captured.

Available Listings

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