Product description
300 mm DPSII upper chamber with Y2O3/yttria coating context, Applied Materials 0040-79200.
Specifications and identifiers
identification
| Primary description | Chamber upper, Y2O3, 300 mm, DPSII |
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| Coating/material context | Y2O3 / yttria |
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| Wafer size | 300 mm |
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| Platform context | DPS II |
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Applications
DPS/DPSII etch chambers300 mm chamber bodiesY2O3-coated chamber hardwareDPSII plasma chamber upper-body replacementYttria-coated chamber hardware for plasma service
How it works
An upper chamber body or assembly forms part of the process chamber structure above the wafer area.
Chamber body geometry, coating, wafer size, and process type are critical for process compatibility and contamination control.
Technical guide
Y2O3
Yttria coating, commonly used for plasma resistance in etch environments.
- DPS
- Decoupled plasma source platform/context in Applied Materials etch tools.
- upper chamber
- Upper body section of a process chamber.
What to verify before purchase
- Confirm coating type and condition, revision, chamber serial compatibility, and whether cleaned/refurbished state is acceptable.
Confirm with the seller
- Exact revision and complete machine compatibility are not confirmed from the provided evidence alone.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.