Product description
300mm TEOS face plate, remote-clean / high-deposition-rate context.
Specifications and identifiers
identification
| Wafer size | 300mm Indicates chamber size context. |
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| Process context | TEOS TEOS oxide deposition context. |
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| Configuration | Remote clean / high deposition rate references Configuration should be matched to the chamber. |
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Applications
PVD chambersCVD chambersetch process kitsscheduled chamber maintenanceTEOS chamber face plate replacementremote-clean CVD chamber maintenance
How it works
A process-kit or shield component protects chamber hardware, shapes plasma or gas flow, or supports deposition/etch process geometry.
Material, coating, cleanliness, and exact geometry directly affect contamination control and process repeatability.
Technical guide
- AMAT
- Applied Materials abbreviation.
- ASSY
- Assembly.
- P/N
- Part number.
- PCB
- Printed circuit board.
- TEOS
- Tetraethyl orthosilicate, commonly used as a silicon dioxide CVD precursor.
What to verify before purchase
- Verify exact revision and configuration against the installed tool.
- Inspect condition, cleanliness, connectors, seals, and any included subassemblies.
Confirm with the seller
- Exact tool compatibility beyond the stated part identity is not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.