Product description
Applied Materials 0041-26723 300 mm CESC electrostatic-chuck bonded assembly, Rev 02 context.
Specifications and identifiers
identification
| Description | 300 mm ESC bonded assembly |
|---|
| ESC type/context | CESC |
|---|
| Revision reference | Rev 02 |
|---|
Applications
process chamber kitsplasma-facing hardwarewafer-area consumables300 mm electrostatic chuck serviceCESC chamber replacementWafer clamping / pedestal assembly maintenance
How it works
A shaped ring used in or around a process chamber, wafer support, or gas/exhaust path.
Material, diameter, flatness, and surface condition can affect fit, plasma behavior, contamination, and process uniformity.
What to verify before purchase
- Verify exact ESC revision and ceramic condition
- Confirm helium/backside-cooling and electrical feedthrough compatibility
- Inspect for cracks, arcing, or delamination
Confirm with the seller
- Exact chamber/process tool compatibility is not confirmed
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.