Product description
Applied Materials 0200-02812 200 mm ceramic deposition ring for SIP TA / SNNF ESC context, described with high-purity Al2O3 and TWAS surface wording.
Specifications and identifiers
identification
| Nominal size | 200 mm |
|---|
| Material | Alumina / Al2O3 wording present; purity varies between 99.8% and 99.9% |
|---|
| Process context | SIP TA / SNNF ESC |
|---|
Applications
PVD chambersESC and wafer support stacksshield and cover-ring assembliesprocess chamber consumablesPVD deposition ring replacementESC/chamber consumable service200 mm process chamber hardware
How it works
A process-facing ring or plate used around the wafer, chuck, or chamber process region.
Geometry, material, coating, and cleanliness affect fit, plasma behavior, particle risk, and process repeatability.
Technical guide
Al2O3
Aluminum oxide / alumina ceramic used for plasma-exposed components
- SIP
- Self-ionized plasma or tool/process context marker; verify on equipment
- TWAS
- Surface/process descriptor that should be confirmed against the part record
What to verify before purchase
- Verify material purity and exact revision from part marking
- Confirm cleaned/refurbished condition and surface finish
- Check for chips, cracks, and deposition wear
Confirm with the seller
- Exact purity and TWAS meaning must be verified
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.