Product description
300 mm ceramic robot blade; one description notes Ti-doped ceramic.
Specifications and identifiers
identified features
| Component | Robot blade Wafer-handling blade component. |
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| Wafer size | 300 mm Wafer size wording appears in descriptions. |
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| Material | Ceramic Repeatedly identified as ceramic; Ti-doped ceramic appears in one description. |
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Applications
Wafer transfer robotsCassette/indexer mechanismsCMP polishing headsHandling calibration300 mm wafer handlingRobot end-effector replacementClean handling of wafers
How it works
A wafer-handling or robot-related component used to hold, transfer, align, or support wafers and handling mechanisms.
Wafer size, edge-contact geometry, robot model, flatness, and cleanliness are critical to avoid wafer damage and positioning errors.
What to verify before purchase
- Confirm blade dimensions and robot compatibility.
- Inspect for chips, cracks, and contamination.
- Verify material and revision on the physical part.
Confirm with the seller
- Ti-doped ceramic is not confirmed for every instance.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.