Product description
Ring, graphite, 200 mm, sputter etch
Specifications and identifiers
cross references
| Referenced material/vendor code | Poco S55POS00200 |
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| Referenced drawing/part codes | 91-00331 / 91-00331A |
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| Platform/context term | DFP-2 |
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identification
| Item type | Graphite ring |
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| Process context | Sputter etch |
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| Nominal wafer size | 200 mm |
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materials
| Material | Graphite Graphite is used in plasma and high-temperature process areas because it tolerates heat and plasma exposure better than many metals. |
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Applications
sputter etch chambers200 mm process modulesplasma-facing chamber hardwaresputter etch chamber consumablegraphite ring replacementplasma-facing shield/ring service
How it works
A graphite process ring is a chamber consumable or shielding ring used around a wafer/process area.
Correct ring dimensions and material are critical for plasma uniformity, particle control, and process compatibility.
Technical guide
graphite
Carbon material commonly used for thermal and plasma tolerance.
sputter_etch
A plasma process that removes material from a surface by ion bombardment.
- DFP-2
- Tool or process-family context term present in the source data; exact platform compatibility should be verified.
What to verify before purchase
- Confirm outer/inner diameter, thickness, groove/profile, and revision against the chamber bill of materials.
- Verify graphite grade and any POCO/material code on the part or packaging.
Confirm with the seller
- Exact chamber model compatibility is not confirmed.
- Whether 91-00331/91-00331A are alternate OEM numbers or drawing references is not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.