Product description
Quartz base plate/baseplate with baffle; some descriptions also describe a quartz cover ring, so baseplate-vs-cover-ring usage should be verified.
Specifications and identifiers
identification
| Material | Quartz Process-facing quartz component supported by repeated descriptions. |
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| Primary description | Baseplate with baffle The dominant phrase in the item description. |
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| Alternate description | Cover ring, quartz One description describes it as a cover ring; verify geometry. |
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Applications
CVD and HDP-CVD chambersetch process modulesCMP head and wafer support assembliesprocess chamber quartz base/baffle componentetch or deposition chamber flow/shielding hardware
How it works
A chamber consumable or process-facing component sits in or near the process environment and influences gas flow, plasma boundary conditions, shielding, or wafer support.
Material, coating, dimensions, and surface condition can affect particles, deposition/etch uniformity, and chamber matching.
Technical guide
- CVD
- Chemical vapor deposition.
- HDP-CVD
- High-density plasma chemical vapor deposition.
- TEOS
- Tetraethyl orthosilicate, a common silicon-oxide precursor.
What to verify before purchase
- Confirm whether the item is used as a baseplate, cover ring, or baffle assembly in the target tool.
- Inspect quartz for chips, cracks, hazing, or contamination.
- Verify dimensions and revision against the removed part.
Confirm with the seller
- Exact chamber/tool compatibility and final installed orientation.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.