Product description
Ceramic lid isolator for TXZ context in Applied Materials CVD equipment.
Specifications and identifiers
physical
| Component type | Lid isolator |
|---|
| Material | Ceramic |
|---|
| Tool/context | TXZ / CVD |
|---|
Applications
CVD chambersPVD chambersEtch chambersTransfer modulesElectrical/thermal isolation in lid or chamber hardwareCVD chamber ceramic replacement
How it works
A chamber mechanical component forms part of the process environment, wafer support area, or shielding/lid structure.
Geometry, material, process family, wafer size, surface finish, and cleanliness can affect fit, particles, and process results.
Technical guide
Vespel
High-performance polyimide commonly used for high-temperature and low-wear parts.
ceramic
Used where electrical insulation, heat resistance, or plasma compatibility is needed.
titanium_nitride
TiN coatings/materials are used in some chamber hardware; verify coating and material marking.
- ESC
- Electrostatic chuck.
- SNNF
- Tool or process-context abbreviation from the provided evidence; verify exact meaning.
- TXZ
- Applied Materials chamber/platform context referenced by the provided evidence.
What to verify before purchase
- Verify ceramic condition, dimensions, surface finish, and TXZ chamber compatibility.
- Inspect for cracks, chips, or plasma/thermal wear.
Confirm with the seller
- Exact ceramic composition and chamber revision are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.