Applied Materials (AMAT) 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMApplied Materials (AMAT) 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MMNEW Applied Materials AMAT 0200-35972 PLATE FINGER LIFT,QUARTZ HT TIN 200MM
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APPLIED MATERIALS 0200-35972

Quartz Finger Lift Plate, 200mm

Market Availability & Pricing

Part number0200-35972
ManufacturerAPPLIED MATERIALS
Current availabilitySee listings below
Latest completed listing with reported salesNo qualifying listing found
Mechanical › Chamber Components › Ceramic & Quartz Parts
Quartz Finger Lift Plate, 200mm
APPLIED MATERIALS0200-35972Quartz lift plate
Product description
Quartz HT TiN 200mm finger lift plate.
Specifications and identifiers
identification
ItemFinger lift plate
Mechanical/process-facing plate associated with wafer lift fingers.
MaterialQuartz
Material stated in the item description.
Process/coating textHT TiN
Text is referenced in the item description; verify exact material/coating meaning on drawing.
Wafer size200mm
Size context identified.
Applications
CVD and HDP-CVD chambersetch process modulesCMP head and wafer support assemblies200mm wafer lift/finger area componentprocess chamber quartz hardware
How it works

A chamber consumable or process-facing component sits in or near the process environment and influences gas flow, plasma boundary conditions, shielding, or wafer support.

Material, coating, dimensions, and surface condition can affect particles, deposition/etch uniformity, and chamber matching.

Technical guide
CVD
Chemical vapor deposition.
HDP-CVD
High-density plasma chemical vapor deposition.
TEOS
Tetraethyl orthosilicate, a common silicon-oxide precursor.
What to verify before purchase
  • Verify exact dimensions, notch/hole pattern, and whether HT TiN denotes coating/process context.
  • Inspect for chips, cracks, or contamination.
Confirm with the seller
  • Exact chamber/platform compatibility.

Product reference only. Confirm fitment, revision, included components, and specifications before purchase.

Documentation

No public documents were listed for this part when captured.

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