Product description
Lower baffle / domed electrode baffle, 6 inch context, for Lam Research equipment.
Specifications and identifiers
physical
| Component type | Lower baffle |
|---|
| Electrode context | Domed electrode |
|---|
| Size context | 6 inch |
|---|
Applications
CVD chambersPVD chambersEtch chambersTransfer modulesLower baffle replacementElectrode-adjacent chamber hardware
How it works
A chamber mechanical component forms part of the process environment, wafer support area, or shielding/lid structure.
Geometry, material, process family, wafer size, surface finish, and cleanliness can affect fit, particles, and process results.
Technical guide
Vespel
High-performance polyimide commonly used for high-temperature and low-wear parts.
ceramic
Used where electrical insulation, heat resistance, or plasma compatibility is needed.
titanium_nitride
TiN coatings/materials are used in some chamber hardware; verify coating and material marking.
- ESC
- Electrostatic chuck.
- SNNF
- Tool or process-context abbreviation from the provided evidence; verify exact meaning.
- TXZ
- Applied Materials chamber/platform context referenced by the provided evidence.
What to verify before purchase
- Verify diameter, material, revision, surface condition, and electrode/chamber compatibility.
- Inspect for coating wear, chips, or plasma erosion before reuse.
Confirm with the seller
- Exact material and target chamber model are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.