Product description
Lam Research ring described as generic dual gas / WAP ring, 12.5 ID, 200 mm, 2300 context.
Specifications and identifiers
ring details
| Component | Ring Process/chamber ring wording is consistent. |
|---|
| Descriptor | Generic dual gas / WAP Abbreviation appears in supported item wording. |
|---|
| Size/context | 12.5 ID, 200 mm, 2300 Size and Lam 2300 context appear in supported wording. |
|---|
Applications
Etch chambersPVD/CVD chambersLoad locksTransfer modulesGas distribution or wafer-area process ring service replacementLam 2300 process module chamber hardware
How it works
A chamber component is a process-facing or vacuum-facing part used inside or around a semiconductor process module.
These parts can affect plasma confinement, deposition uniformity, wafer support, contamination control, and vacuum sealing.
Technical guide
common
Often process-compatible metals, ceramics, quartz, engineered polymers, or coated surfaces.
process compatibility
Material and coating compatibility are important because parts may see plasma, heat, vacuum, or process gases.
What to verify before purchase
- Clarify WAP/WP abbreviation, ring material, coating, and exact chamber configuration.
Confirm with the seller
- Material and exact dual-gas function are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.