Product description
Lam Research electrostatic chuck described as OXIDE HX+ ESC, dual-zone bottom-mounted/flex context.
Specifications and identifiers
esc details
| Chuck type | ESC chuck Electrostatic chuck. |
|---|
| Process/context | Oxide HX+ |
|---|
| Configuration terms | DZ, BTM-MTD, FLEX HX Likely dual-zone/bottom-mounted/flex heat-exchanger context; verify labels. |
|---|
Applications
etch chambersoxide etchelectrode assemblieswafer temperature controloxide etch wafer clampingwafer thermal controlLam process module chuck assembly
How it works
An electrostatic chuck or chuck-related component used to hold and thermally manage a wafer during processing.
Wafer size, clamp voltage design, helium backside cooling, heater/chuck style, and chamber revision are critical compatibility factors.
What to verify before purchase
- Confirm wafer size, exact revision, condition, and whether arcing/damage is present.
- Verify DZ/BTM-MTD/FLEX HX markings and compatibility with the installed Lam chamber.
Confirm with the seller
- Exact Lam platform and revision compatibility are not confirmed.
Product reference only. Confirm fitment, revision, included components, and specifications before purchase.